MediaTek today announced the new Dimensity 920 and Dimensity 810 chipsets, the latest additions to its Dimensity 5G family.
Designed for powerful 5G smartphones, the Dimensity 920 balances performance, power and cost to provide an incredible mobile experience. Built using the 6nm high-performance manufacturing node, it supports intelligent displays and hardware-based 4K HDR video capture, while also offering a 9% boost in gaming performance compared to its predecessor, the Dimensity 900.
The Dimensity 810 is built using the 6nm high-performance manufacturing node. It provides Arm Cortex-A76 CPU speeds up to 2.4GHz, premium camera features including artistic AI-color in collaboration with Arcsoft, and advanced noise reduction techniques for superb low-light photography.
“With the expanded Dimensity chipset series, MediaTek is providing device makers and smartphone users with the latest innovations at more accessible price points for the mainstream market,” said Dr. JC Hsu, Corporate VP and GM of MediaTek’s Wireless Communications Business Unit. “Delivering a boost in performance, display intelligence and image brilliance, these new Dimensity chipsets will improve user experiences and deliver advanced 5G features and capabilities to 5G smartphones.”
MediaTek’s Dimensity 5G series brings smartphones an unrivaled combination of connectivity, multimedia, AI and imaging innovations to global markets with the Dimensity 700, 800, 900, 1000, 1100 and 1200 families. With support for every cellular connectivity generation, the new Dimensity 5G chips deliver the latest connectivity features including 5G standalone (SA) and non-standalone (NSA) architectures, 5G two carrier aggregation (2CC) including mixed mode FDD+TDD, dynamic spectrum sharing (DSS) technology support, True Dual SIM 5G (5G SA + 5G SA) and Voice over New Radio (VoNR).
The new MediaTek Dimensity 920 and Dimensity 810 will power 5G smartphones that are expected to launch in the global market in Q3 2021.
Source: MediaTek Press Release