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In his keynote speech at SEMICON Taiwan’s Smart Manufacturing Forum, TSMC’s head of Advanced Packaging Technology and Service, Dr. Marvin Liao, showcased TSMC’s latest progress in its 3DFabric platform for silicon stacking and advanced packaging technologies. Above all, he revealed that TSMC planned to integrate its frontend and backend processes through automation.

Dr. Liao noted that when process technology moved beyond 3nm, chiplet became a necessary solution, and TSMC’s integration plan would significantly improve its capability to bring these chiplets to market.

TSMC’s 3DFabric family consists of frontend and backend technologies. The frontend technology focuses on the 3D System on Integrated Chips (SoIC), while the backend process includes the 2.5D Chip-on-Wafer-on-Substrate (CoWoS) and Integrated Fan-Out (InFO) technologies.

Dr. Liao indicated that TSMC was on track to build a fully automated smart factory that would integrate SoIC, CoWoS and InFO, empowered by its latest advanced material handling system. Furthermore, TSMC had developed a manufacturing system – SiView Plus – to support the integration.

The equipment for SoIC is expected to be deployed this year, while the section for 2.5D packaging technologies would be completed next year.