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MediaTek and NEC Platforms, Ltd. today announced the first NEC 5G customer-premise equipment (CPE) and mobile Wi-Fi (Mi-Fi) products powered by MediaTek’s T750 5G chipset. This is the first time that MediaTek and NEC Platforms have collaborated on CPE products. These products provide 5G speeds right out of the box and are an affordable broadband alternative to areas with limited DSL, cable or fiber services, bringing super-fast connectivity to all areas including suburban, rural and high-density locations.

The new Mi-Fi product, “Speed Wi-Fi 5G X11,” will be launched in October 2021, followed by the CPE product, “Speed Wi-Fi HOME 5G L12,” coming in November 2021, distributed by KDDI Corporation, Okinawa Cellular Telephone Corporation, and UQ Communications Inc. These new 5G Mi-Fi and CPE products will be also added as a part of the new 5G devices for NEC Platforms’ Aterm product portfolio, and the full portfolio will be launched in the Japanese market in 2022. NEC Platforms has shipped its Aterm’s successful product line with a total of 35 million mobile and home routers to date and will provide consistent support for the development, manufacturing and maintenance of its 5G data communications equipment in Japan with its high quality and reliable solutions.

“MediaTek’s broad portfolio of 5G solutions is bringing incredible 5G experiences to smartphones, laptops, CPE, Mi-Fi devices and beyond,” said Martin Lin, Deputy General Manager of Wireless Communications Business Unit at MediaTek. “With our first collaboration with NEC Platforms in the CPE segment, we are continuing our commitment to bring everyone fast and reliable 5G connectivity. We look forward to further expanding our footprint in the Japanese market and helping to accelerate the rollout of 5G in the region.”

“We believe that combining MediaTek’s connectivity technology and NEC Platforms’ broadband expertise will help make 5G more accessible to consumers across Japan,” said Kanji Shuke, Executive Vice President at NEC Platforms. “The Aterm series has already been well received by many customers for its stable and reliable connectivity, and we will continue to strive to create products that exceed consumers’ expectations.”

MediaTek’s T750 5G chipset is a highly integrated, 7nm compact chip design with support for sub-6GHz frequencies and two component carrier aggregation (2CC CA) for extended coverage. The T750 design integrates a 5G NR FR1 modem, quad-core Arm Cortex-A55 processors and the required peripherals all on a single chip. This enabled NEC Platforms to build high-performance CPE devices that are compact and easy for consumers to self-install. The T750 chipset comes pre-integrated with software drivers for MediaTek’s connectivity solutions such as our 4×4 and 2×2 + 2×2 dual-band Wi-Fi 6 chipsets. The chipset also integrates MediaTek’s 5G UltraSave technologies for ultra-power-efficiency.

For operators, the T750 provides 5G speeds up to an impressive 4.7Gbps right out the box, rivaling or exceeding fixed line services; using already installed cellular infrastructure, operators can avoid the costs of laying down cables or fiber. For original design manufacturers (ODMs) and original equipment manufacturers (OEMs), the T750 reduces development times and costs, providing significant time-to-market advantages. Additionally, consumers can self-install the compact 5G CPE devices powered by the T750, avoiding the hassles of lengthy installation times. Consumers also have the flexibility to place 5G CPE devices anywhere on their property, instead of being limited to being within reach of a phone or fiber line.

MediaTek’s extensive 5G portfolio makes 5G connectivity more accessible by powering a range of devices – from the high-end to the mid-tier – so consumers can unlock the possibilities that 5G brings with ultra-fast and reliable connectivity.

NEC Platforms’ CPE and Mi-Fi products powered by MediaTek are expected to reach the Japan consumer market starting in October 2021.

 

Source: MediaTek