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Semiconductor Manufacturing International Corp. (SMIC), China’s main foundry company and also the world’s fifth largest behind GlobalFoundries, United Microelectronics Corp., Samsung and TSMC, has revealed the latest detail of its 300mm fab construction plan in the southeastern city of Shenzhen, China. SMIC has estimated to spend US$2.3 billion on the new fab, with volume production beginning in 2022. The initial capacity will be 20,000 wafers per month, eventually reaching 40,000 wafers per month by 2023. SMIC is simultaneously planning another 300mm fab in Shanghai, with monthly capacity at 100,000 wafers per month. SMIC expects to spend US$8.8 billion on it. 

The Shenzhen fab will use mature process nodes at and above 28nm, focusing especially on power ICs, LCD drivers, and CMOS image sensors. As a result of the chip shortage crisis, 200mm capacities have been overloaded, driving the production of power ICs to 300mm wafers. As Chinese policies have prioritized domestic semiconductor companies in capacity allocations, SMIC’s new fabs will likely be more beneficial to Chinese companies. The preference has also driven major SMIC customers like Qualcomm to Taiwanese foundries, exacerbating the chip shortage.

 

 

Source: Commercial Times, UDN